- Integrated Circuits[10]
- Transistors[1]
- LCD Modules[5]
- Other Electronic Components[7]
- Double-Sided PCB[8]
- FPC[10]
- Multilayer PCB[10]
- Other PCB & PCBA[10]
- Rigid PCB[10]
- LED Backlights[1]
RO3000 Series High Frequency Laminates for communication
RO3000 Series
1.Best service and high quality goods
2.Fast produce and one-stop service
3.Low cost and delivery fast
RO3000 Series
RO3000® Series High Frequency Laminates
RO3003™, RO3006™ and RO3010™ Laminates
Low dielectric loss (RO3003™ laminates) • Laminates can be used in applications up to 30-40GHz.
Excellent mechancial properties versus temperature • Reliable stripline and multilayer boards constructions
Uniform mechanical properties for a range of dielectric • Ideal for multilayer board designs with a range of dielectric constants.
• Suitable for use with epoxy glass multilayer board hybrid designs.
Stable dielectric constant versus temperature and frequency • Ideal for band pass fi lters, microstrip patch antennas,
(RO3003 laminates) and voltage controlled oscillators.
Low in-plane expansion coeffi cient (matched to copper) • Allows for more reliable surface mounted assemblies
• Ideal for applications sensitive to temperature change
• Excellent dimensional stability.
Volume manufacturing process • Economical laminate pricing.
• Automotive collision avoidance systems • Automotive global positioning satellite antennas
• Cellular and pager telecommunications systems • Patch antennas for wireless communications
• Direct broadcast satellites • Datalink on cable systems
• Remote meter readers • Power backplanes
STANDARD THICKNESS STANDARD PANEL SIZE STANDARD COPPER CLADDING
RO3003: RO3003/RO3006/RO3010: ½ oz. (17μm), 1 oz. (35μm),
0.005” (0.13mm) 12” X 18” (305 X 457mm) 2 oz. (70μm) electrodeposited copper foil.
0.010” (0.25mm) 24” X 18” (610 X 457mm) Other claddings may be available. Contact
0.020” (0.50mm) customer service.
0.030” (0.75mm)
0.060” (1.52mm)
RO3006/RO3010:
0.005” (0.13mm)
0.010” (0.25mm)
0.025” (0.64mm)
0.050” (1.28mm)